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AME Technology in MEMS Microelectromechanical Systems

Date_ 15 October 2020 Time_ 10_00 AM (EDT) I 4_00 PM (CEST)

AME Technology is the Future

MEMS Packaging Solutions everyone needs to know about

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HiPED and so called Heterogeneous Integrations are possible with the DragonFly LDM.

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Valentin Storz
GM of EMEA, Nano Dimension
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The final results of our new packaging are: Compact, Thin, Reliable and Compliant.

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Dr. Antonio Qualtieri
Researcher, CBN-IIT

Download the Webinar here:

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