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Electronics

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Additively Manufactured Electronics offer a variety of Applications

Advanced RF Devices

From new radio-frequency (RF) devices tested in space, to innovative, high-performance electronics devices (Hi-PEDS®) for 5G, Additively Manufactured Electronics (AME) delivers vast opportunities in product development to take electronics to new levels of performance, fit, and function.

Read the White paper on 3D printed single-substrate multi-metal layer antennas.

In-House Sensors

Generate custom 3D-printed sensor devices in-house with higher performance and accuracy.

Take advantage of AME’s new flexibility to create organic shapes and more compact designs for better sensing and reporting.

Read more about additively manufactured environmental sensors

Proven PCB Assembly Solutions

Flexible and smart Surface Mount, dispensing and Pick and Place technologies from Essemtec are now part of Nano Dimension. These solutions enable manufacturers in prototyping and short runs of completed PCBs at an affordable cost. 

Read more about Essemtec

Reliable 3D printing for electronics

DragonFly IV and FLIGHT Software – Precision additive manufacturing system for electronics.

Simultaneous 3D printing of silver and dielectric materials
allow the production of novel and innovative electronic device designs in 3D space.

  • Keep IP secure through in-house production
  • Prototype new designs in hours
  • Reduce environmental footprint

Read more about the DragonFly IV 3d printer

Quality parts with powerful results

L3 Harris Communications Component

Hensoldt

Wearables

“The ability to manufacture RF systems in-house offers an exciting new means for rapid and affordable prototyping and volume manufacturing. The results of the study provide substantial motivation to develop this technology further.”

Dr. Arthur Paolella,
Space and Intelligence Systems, L3 Harris Corporation. R.L. Download Case study

“Military sensor solutions require performance and reliability levels far above those of commercial components. To have high-density components quickly available with reduced effort by means of 3D printing gives us a competitive edge in the development process of such high-end electronic systems.”

Thomas Müller
CEO Hensoldt

“The suitability of the DragonFly system to rapidly and affordably manufacture functional prototypes makes it an ideal choice for our team to achieve higher performance, quick development and print complex shapes not achievable using traditional manufacturing processes.”

Prof. Massimo De Vittorio
CBN-IIT — Lecce — Italy

Read the case study

More on Additively Manufactured Electronics

View All Resources
Whitepaper
20 Nov 2021
3D-Printed Low-Profile Single-Substrate Multi-Metal Layer Antennas and Array With Bandwidth Enhancement

This paper presents a few single-substrate multi-metal layer antennas using additively manufactured
electronics (AME) solution based on piezoelectric additive fabrication. By vertically stacking metal
layers in a 3D printed single substrate, the designed antenna prototype exhibits the advantages of wide bandwidth and ultra-low profile.
Whitepaper
09 Oct 2021
Achieving Multi-Material Ultrathin Metasurfaces with Additively Manufactured Electronics

By taking advantage of the conductive and
dielectric multi-material-integrated additive manufacturing technique, the proposed transmissive MS has an ultrathin thickness (0.11 free-space wavelength)

Blog
11 Jul 2019
How Does Additive Manufacturing Affect Form, Fit, and Function of Electronic Components?

Designs for newer electronic devices carry more stringent requirements on form factor, which places further constraints on component footprints. In new IoT devices, 5G-capable mobile devices, and wearables, one can expect the required level of functionality to continue increasing as time goes on, which makes a cramped situation inside the packaging for these devices even […]

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