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Materials

Multi-material 3D printing enables designers to simultaneously print metal traces and insulating polymers to quickly and precisely build complex, functional circuit boards and other innovative devices.

Nano Dimension is a global pioneer in bringing nanoparticle multi-material additive manufacturing to electronics. It empowers designers and engineers to print polymers and metals simultaneously to create functional electronic components.

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High Performance Nano-Inks for Printed Electronics

Optimizing nanoparticle inks to various applications requires fine control over the ink formulation and production processes. At Nano Dimension, our award-winning AgCite™ and dielectric inks used by the flagship DragonFly™ platform are developed in-house, in a dedicated nano-ink facility.

The inks have unique and compatible sintering and curing properties, tightly controlled particle sizes, as well as excellent stability for precision additive manufacturing tasks.

The unique pairing of a dielectric ink optimized for mechanical support, thermal resistance and electrical insulation with a highly conductive nano-Silver ink that sinters at low temperatures is solving key challenges in the electronics world. With the DragonFly™ platform’s ability to utilize both inks concurrently in a print job, alongside its high print resolution and pinpoint precision, the system enables virtually limitless design flexibility in a wide array of applications and industries.

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Agcite Nanopartice Silver Ink

Nano Dimension’s AgCite™ nanoparticle Silver inks offers multiple roundbreaking advantages over traditional materials. Years of R&D have enabled us to reliably extract pure Silver particles of 10 to 100 nanometers in size, while controlling for other characteristics such as shape and particle dispersion.This ensures that each batch of customized AgCite™ nano-Silver ink can be optimized for a wide range of applications such as RFID and OLED components, while maintaining excellent conductivity, adhesion and flexibility.

Dielectric Nanoparticle Polymer Ink

Our suite of dielectric polymer inks are designed to complement the conductive AgCite™ nano-Silver ink and provide essential electrical insulation even when printed down to hundred-micron widths. To ensure reliability and optimization for multilayer PCB printing, we have engineered specific properties in interference, adhesion, thermal dissipation and flammability into the ink formula used. The photopolymer dielectric inks are UV cured as part of the DragonFly™ print process. During printing ultraviolet light exposure is algorithmically controlled to ensure optimal material properties. These inks are highly compatible with Nano Dimension’s conductive AgCite™ family of nano-Silver inks for simultaneous inkjet printing on the DragonFly™ platform and can also be printed on a range of substrate surfaces, including glass.

For more technical information, download the free DragonFly system brochure.

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Case Study:

Conductive Inks for RFID Antennas

Developing Conductive Inks for RFID Antennas antennaNano Dimension provides conductive inks specifically tailored for use in antennas, such as in the Radio-Frequency Identification (RFID) systems that are quickly being incorporated into many intelligent systems today.

Our AgCite™ inks deliver outstanding results after deposition by contactless digital inkjet printing. Third party tests have proven that our nano-Silver antennas can easily match today’s industry efficiency benchmarks, with 89% antenna efficiency at 2 GHz.

For more technical information, download our free RFID White Paper below.

Use Case Harris Corp.:

3D Printed RF Amplifier

Harris Corporation and Nano Dimension worked together on a study to explore the potential use of 3D printing for radio frequency (RF) circuits for RF systems. The project included designing, simulating and testing an RF amplifier 3D printed on the DragonFly™ Pro System and comparing it with the performance of an amplifier developed with conventional manufacturing techniques.

The resulting data showed similar RF performance between the 3D printed and the baseline amplifiers, demonstrating the viability of 3D printing technology to produce a functional RF circuit.

Read more about this research in the case study.