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Molded Interconnect Devices (MIDs) provides a high degree of design flexibility and miniaturization. With the DragonFly Pro 3D printer’s ability to print both dielectric and conductive inks concurrently, not only is production time kept low, but conductive traces can now be printed within the insulating materials.

Everyone makes mistakes, but that doesn't mean manufacturers need to incur huge time and cost penalties correcting them. Learn how one company managed to redesign and 3D print 30 Ball Grid Array PCBs on the DragonFly™ Pro system in just one day upon unearthing a design error.

In an IoT world, we interact with our gadgets, tools, environment and vehicles in new ways such as touch, eye tracking or speech. As product formats change and features evolve, there is the need to develop new sensors to facilitate this ‘electronics everywhere’ era where monitoring and effortless control become paramount.

Harris Corporation and Nano Dimension worked together to explore the potential use of 3D printing for radio frequency (RF) circuits. The resulting data showed similar RF performance between 3D printed and the baseline amplifiers, demonstrating the viability of 3D printing technology to produce a functional RF circuit.

Controlling the wavefront and manipulating the polarization of the electromagnetic wave using an ultrathin flat device are highly desirable in many emerging fields.

Formatec manufactures products from ceramic materials, such as alumina, zirconia, and silicon nitride, and develops new ceramic materials.