Modern electronics demands improved performance, functionality and increased miniaturization. This creates the need for curved surfaces and 3D printed layers that are not flat or of uniform thickness. The challenge is to produce optimized electronic prototypes, embedding the electronics in any shape, in order to authenticate new product designs.

With the DragonFly Pro System's ability to simultaneously 3D print dielectric polymer and conductive metal traces, creating complex PCB structures involving many layers of conductive traces, vias and through holes becomes a breeze.