Filter By “Additive Manufacturing of Electronics”

the design and performance of planar capacitors fabricated with multi-material and multi-layered Additive Manufacturing Electronics (AME) technology, enabling capacitors with different areas and different layer counts resulting in capacitance values from a few picofarads (pF) to several nanofarads (nF).

This paper presents a few single-substrate multi-metal layer antennas using additively manufactured electronics (AME) solution based on piezoelectric additive fabrication. By vertically stacking metal layers in a 3D printed single substrate, the designed antenna prototype exhibits the advantages of wide bandwidth and ultra-low profile.

DragonFly IV multi-material 3D printer for Additively Manufactured Electronics (AME) powered by the FLIGHT Software suite, launched in November 2021.

By taking advantage of the conductive and dielectric multi-material-integrated additive manufacturing technique, the proposed transmissive MS has an ultrathin thickness (0.11 free-space wavelength)

The realization of custom-designed 3D printed circuit boards (PCBs) was achieved with a Nano Dimension DragonFly 3D printer which enables PCBs that are designed around a standard 1.25mm ferrule for optical connection of the optical fiber to provide full compatibility with standard light delivery system.

In this work, a shared-aperture dual-band FZP metalens antenna is proposed by merging two single-band FZP metalens antennas, operating at distinct frequency bands, seamlessly into one. Instead of using conventional metallic conductors, double-screen meta-grids are devised in this work to form the concentric rings.

It’s very likely additive manufactured electronics (AME) will be central to building the next generation of highly integrated device antennas. The current high cost and long cycle of production for mm-wave antenna-in-package (AiP) makes proof-of-concept customized prototyping difficult.

Learn how integrating piezoelectric thin film with multi-material metal-and-dielectric 3D printing, can produce flexible sensors that are suitable for testing opto-electro-mechanical performance and biochemical sensing.

The story of electronics is one of miniaturization and greater integration of disparate functionality into a single device. This has progressed at the integrated circuit level through continued scaling of transistor architecture to smaller sizes. This has also occurred at the PCB level through higher routing density, which is driven by the creative use of...