Filter By “Additive Manufacturing of Electronics”

Academic science, defense, and R&D labs, however, are exploring more unusual forms of conductive metal and polymer structures to test experiments and uncover new phenomena. Our latest research study features not conventional electronic components but rather an array of small metal structures that would be difficult, if not impossible, to fabricate any other way.

IoT sensors help provide full interconnectivity between a wide range of objects. Learn more about how the DragonFly Pro 3D printer was used to create this temperature and humidity sensor that can be incorporated into many applications.

Molded Interconnect Devices (MIDs) provides a high degree of design flexibility and miniaturization. With the DragonFly Pro 3D printer’s ability to print both dielectric and conductive inks concurrently, not only is production time kept low, but conductive traces can now be printed within the insulating materials.

Everyone makes mistakes, but that doesn't mean manufacturers need to incur huge time and cost penalties correcting them. Learn how one company managed to redesign and 3D print 30 Ball Grid Array PCBs on the DragonFly™ Pro system in just one day upon unearthing a design error.

In an IoT world, we interact with our gadgets, tools, environment and vehicles in new ways such as touch, eye tracking or speech. As product formats change and features evolve, there is the need to develop new sensors to facilitate this ‘electronics everywhere’ era where monitoring and effortless control become paramount.

Harris Corporation and Nano Dimension worked together to explore the potential use of 3D printing for radio frequency (RF) circuits. The resulting data showed similar RF performance between 3D printed and the baseline amplifiers, demonstrating the viability of 3D printing technology to produce a functional RF circuit.

the design and performance of planar capacitors fabricated with multi-material and multi-layered Additive Manufacturing Electronics (AME) technology, enabling capacitors with different areas and different layer counts resulting in capacitance values from a few picofarads (pF) to several nanofarads (nF).

This paper presents a few single-substrate multi-metal layer antennas using additively manufactured electronics (AME) solution based on piezoelectric additive fabrication. By vertically stacking metal layers in a 3D printed single substrate, the designed antenna prototype exhibits the advantages of wide bandwidth and ultra-low profile.

DragonFly IV multi-material 3D printer for Additively Manufactured Electronics (AME) powered by the FLIGHT Software suite, launched in November 2021.