Multimaterial 3D printing is game-changing, allowing designers and engineers to print polymers and metals together to create functional electronic parts. This is a revolutionary approach to making electronics with the potential to enable more compact, denser and ultimately non-planar designs.
Our portfolio of new materials provide exceptionally reliable printability and outstanding electrical properties, offering significant time and cost benefits over traditional processes used to produce functional electronic devices.
We are proud to present our state-of-the-art AgCite™ family of nanoparticle silver inks with unparalleled conductivity for inkjet deposition.
Nano Dimension’s ink scientists can reliably extract 10-100+ nanometer-sized particles of pure silver. Our ability to control the size, shape and dispersion of the silver nanoparticles in accordance with the printing requirements of our customers is critical in formulating the best conductive inks available. This allows us to achieve the highest ink performance optimization in properties such as conductivity, adhesion and flexibility, in a wide range of applications including RFID and OLED, from the particle level all the way through formulation to the printing process itself.
The AgCite™ family of inks sinters at low temperatures and is suited to a broad range of substrates including paper, polymers, glass and ITO. With unparalleled conductivity, less ink is needed for the same application requirement, bringing about major cost-savings.
Nano Dimension has also developed a suite of dielectric inks to meet the advanced needs of the electronics community. The insulating properties of these materials is just as important and advanced as the conductive properties of the conductive inks.
For electronic circuits to function properly, properties relating to interference, adhesion, thermal dissipation and flammability have to be engineered into the ink. Our one-part insulating dielectric material provides solutions suited for both rigid and flexible circuits. For more detailed information, download our Dielectric Ink Brochure.
Nano Dimension has developed novel copper nanoparticles that are resistant to oxidation, and fuse into conductive lines after sintering at <160°C.
The innovative copper nanoparticles are used as a basis to develop conductive ink that can significantly reduce the cost of the raw-materials used in 3D printing of electronics and PCBs.
Highest conductivity in the market - 35,700,000 S/m
Nano Dimension can control the shape, size, and distribution of particles
Custom-formulated inks will work with your specific printer and substrate
We make our own inks, which is critical to understanding their complexity
Nano Dimension provides conductive inks specifically tailored for use in antennas, including radio-frequency identification (RFID) technology for a variety of devices including smart cards, various ID products, arrays and more.
The AgCite™ family of nanoparticle silver inks, deposited by contactless, digital, inkjet printing, deliver outstanding results. Third party tests demonstrate the inks matching industry efficiency benchmarks with 89% antenna efficiency at 2 GHz.
As well as delivering unparalleled conductivity, this process replaces the etching process used for making most copper antennas, which is expensive, inflexible and creates toxic waste. Additional benefits include digital manufacturing flexibility as well as excellent printed line and space resolution. This allows antenna designers more flexibility when addressing the demanding requirements of today’s antenna applications.
Nano Dimension boasts a dedicated nano-ink facility. The facility allows us to efficiently scale-up and produce commercial scale batches of nanoparticle conductive and dielectric inks. Scientists will produce advanced nano inks for the DragonFly 2020 Pro 3D PCB Printer, the company's first commercial 3D printer for rapid prototyping of complex multilayer printed circuit boards.
Our breakthrough inks have unique compatible sintering and curing properties, as well as ink stability enabling precision, and engineered metal particle size. This unique combination of a dielectric material (for mechanical structure, high-temperature resistance and electrical insulation) and a conductive material for the circuitry with a very low melting point, solve some of the major challenges that, thus far, have prevented widespread use of 3D printed electronics. Our inks make it possible to quickly print three-dimensional, high performance, low-cost conductive patterns as well as complex structures on relatively heat sensitive substrates with the DragonFly 2020 Pro.