By combining high-resolution conductive and dielectric traces and spaces in a single print job, the DragonFly™ System makes it possible to print a full range of multi-layer PCB features, from intricate geometries to interconnections such as buried vias and plated through holes, seamlessly into multi-layer PCBs for agile product development. The result is a high-quality, densely packed PCB, printed in less than 24 hours, ready for component placement and soldering.
The DragonFly™ System makes it possible to 3D print antennas, arrays and Radio Frequency Identification (RFID) tags using conductive nano-particle silver and dielectric inks. This innovation enables antennas to play a role in more products and locations.
Additive manufacturing of sensor components opens up new possibilities for emerging applications and eliminates many design limitations, especially those related to rigid planar electrical designs.
With the DragonFly™ System, creating dense and functional multi-layer PCBs is now a one-day in-house job involving an unrivaled degree of automation. Never have rapid prototyping and small-batch customized manufacturing of complex PCB designs been so quick and risk-free.
High performance materials for PCB production
Get prototypes on hand within hours, not weeks
Creativity not stifled by complexity or layer count
Not outsourcing means lower costs; no IP security risks
