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Multi-layer PCBs

3D Printing for Multi-layer PCBs

By combining high-resolution conductive and dielectric traces and spaces in a single print job, the DragonFly™ Pro System makes it possible to print a full range of multi-layer PCB features, from intricate geometries to interconnections such as buried vias and plated through holes, seamlessly into multi-layer PCBs for agile product development. The result is a high-quality, densely packed PCB, printed in less than 24 hours, ready for component placement and soldering.

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The DragonFly™ Pro System makes it possible to 3D print antennas, arrays and Radio Frequency Identification (RFID) tags using conductive nano-particle silver and dielectric inks. This innovation enables antennas to play a role in more products and locations.

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Additive manufacturing of sensor components opens up new possibilities for emerging applications and eliminates many design limitations, especially those related to rigid planar electrical designs.

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The DragonFly™ Pro System can 3D print rigid-flex electronic components, consisting of both rigid and flexible parts. Designs can now combine the best of both worlds — rigidity where mechanical strength is needed and flexibility where bending is required.

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With the DragonFly™ Pro System, creating dense and functional multi-layer PCBs is now a one-day in-house job involving an unrivaled degree of automation. Never have rapid prototyping and small-batch customized manufacturing of complex PCB designs been so quick and risk-free.

High
Conductivity
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High performance materials for PCB production

Fast
& Efficient
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Get prototypes on hand within hours, not weeks

Flexible
Production
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Creativity not stifled by complexity or layer count

Affordable
& Secure
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Not outsourcing means lower costs; no IP security risks