How 3D integrated electronics can take us beyond Moore’s Law.
According to many scientists and industry pundits, Moore’s Law may be coming to an end. While it hasn’t collapsed yet, a new level of innovation is now required to ensure that compute electronics consistently expand their capability, speed and performance.
However, new opportunities using Additively Manufactured Electronics (AME) mean that use of the 3D space can deliver the ability to more efficiently integrate electrical, optical, thermal, magnetic and mechanical properties within a single package.
Read the white paper on how AME enables 3D heterogeneous integration to continue to keep Moore’s Law valid while delivering new possibilities and innovation in electronics design and production.