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The disclosure relates to assemblies, kits and methods for alignment of inkjet print heads. More particularly, the disclosure relates to assemblies, kits and methods facilitating the alignment of inkjet printheads by selectably modulating the printheads' phase, registration, and yaw relative to the printing direction and optionally, with respect to an additional printhead or printheads.

The disclosure relates to systems, methods and compositions for direct printing of printed circuit boards with embedded integrated chips. Specifically, the disclosure relates to systems methods and compositions for the direct, top-down inkjet printing of printed circuit board with embedded chip and/or chip packages using a combination of print heads with conductive and dielectric ink compositions, creating predetermined dedicated compartments for locating the chips and/or chip packages and covering these with an encapsulating layer while maintaining interconnectedness among the embedded chips. Placing of the chips can be done automatically using robotic arms.