Filter By “DragonFly IV”

Inkjet Printing of Three Dimensional Ceramic Pattern

The disclosure relates to systems, methods, and compositions for inkjet printing of ceramic dielectric portions. Specifically, the disclosure relates to systems, methods and compositions for the inkjet printing of three dimensional patterns formed from pre-ceramic, polymer-derived interpenetrated networks, that are comprised of at least two phases, or bi-continuous phases, one formed by free radical polymerization and the other by sol-gel polymerization.

Fabrication of Pcb with Shielded Tracks And/Or Components Using 3d Inkjet Printing

The disclosure relates to methods and compositions for direct printing of circuit boards having an electromagnetically-shielded tracks and/or components. Specifically, the disclosure relates to the direct, uninterrupted and continuous 3D printing of insulation-jacketed tracks and/or components with metallic shielding sleeves or capsule.

Rigid-flexible Printed Circuit Board Fabrication Using Inkjet Printing

The disclosure relates to methods and compositions for direct printing of rigid flexible electronic objects. Specifically, the disclosure relates to methods, systems and compositions for the direct, optionally simultaneous inkjet printing of rigid-flexible electronics, for example, rigid-flexible PCBs, FPCs, TFTs, antennae solar cells, RFIDs and the like, using a combination of print heads with flexible and rigid conductive and dielectric ink compositions.

Devices, Systems and Methods for Inkjet Print Head Maintenance

The disclosure relates to devices, systems and methods for contactless maintenance of inkjet print heads. Specifically, the disclosure relates to devices, systems and methods for removing purged ink from inkjet print head without contacting the aperture plate by drawing vacuum, with liquids or other mechanical means, such as wipes.

Inkjet Print Head Clean-in-place Systems and Methods

The disclosure relates to systems and methods for direct clean-in-place (CIP) of inkjet print heads. More particularly, the disclosure relates to systems and methods for facilitating CIP of inkjet print heads by selectably alternating the position of a mask disposed between the print head and a printing surface, between printing position, cleaning position and/or purging positions.

Inkjetprint Heads Alignment Assembly, Kits and Methods

The disclosure relates to assemblies, kits and methods for alignment of inkjet print heads. More particularly, the disclosure relates to assemblies, kits and methods facilitating the alignment of inkjet printheads by selectably modulating the printheads' phase, registration, and yaw relative to the printing direction and optionally, with respect to an additional printhead or printheads.

Chip Embedded Printed Circuit Boards and Methods of Fabrication

The disclosure relates to systems, methods and compositions for direct printing of printed circuit boards with embedded integrated chips. Specifically, the disclosure relates to systems methods and compositions for the direct, top-down inkjet printing of printed circuit board with embedded chip and/or chip packages using a combination of print heads with conductive and dielectric ink compositions, creating predetermined dedicated compartments for locating the chips and/or chip packages and covering these with an encapsulating layer while maintaining interconnectedness among the embedded chips. Placing of the chips can be done automatically using robotic arms.