Filter By “DragonFly IV”

Methods for Direct and/or Indirect Inkjet Printing of Electromagnetic Band Gap Elements

The disclosure relates to methods for direct and/or indirect inkjet printing of Electromagnetic Band Gap (EBG) elements having a structure of periodic mushroom-type cells enabling a reduced footprint for a very wide range of frequencies, for example between 500 MHz to about 30 GHz

Computerized Systems and Methods for Using Additive Manufacturing of Simultaneous Deposition or Conducive and Dielectric Inks

The disclosure relates to computerized systems and methods for using additive manufacturing (AM) of simultaneous deposition of conductive and dielectric inks to form RC frequency pass filters having predetermined cutoff frequency with wide stop band frequency

Methods and Devices for Mitigating Warpage in PCBs, HFCPS with SMT During Reflow Processing

The disclosure relates to methods and devices for a) mitigating warpage in printed circuit boards (PCBs) and high-frequency connect PCBs (HFCPs) with surface mounted chip packages (SMT) during reflow processing, and b) optional enclosing of the entire PCB with an encapsulating layer reflecting the negative image of the external layers populated PCB.

Methods for Fabricating Coreless PCB-Based Transformers and/or Inductors Having Concatenated Helix Architecture

The disclosure relates to methods for fabricating coreless PCB-based transformers and/or inductors having concatenated helix architecture of their primary and secondary windings using layer-by-layer printing of dielectric and conductive patterns

Fabrication of 3D Components Having Conductive and Dielectric Constituents

The disclosure relates to fabrication of three-dimensional component having conductive and dielectric constituents comprising voids by using water soluble support ink, capable of undergoing all processing steps for fabricating the dielectric and conductive constituents.

Methods, Systems, and Compositions for the Fabrication of Ceramic Composite Components

The disclosure relates to methods, systems and compositions for the fabrication of ceramic composite components having improved or modulated thermo-mechanical properties, as well as derivative dielectric strength, using for example, inkjet printing.

Additive Manufacturing Methods for Additively Manufactured Electronic (AME) Circuits, PCBS, and/or FPCs, and HDIPCBs

The disclosure relates to additive manufacturing methods for additively manufactured electronic (AME) circuits such as a printed circuit board (PCB), and/or flexible printed circuit (FPC), and/or high-density interconnect printed circuit board (HDIPCB) each having integrated raised and/or sunk BGA, SMT, and/or surface mounting sockets for SMT device(s) defined therein, and methods of coupling surface mounted devices such as BGA and/or SMT thereto.

Continuous Printing of Colored Resin and Metallic Composite Components Using Inkjet Printing

The disclosure relates to continuous printing of colored resin and metallic composite components using inkjet printing

External Portable Systems and Jig Assemblies for Cleaning Clogged Nozzles of Ink Jet Print Heads Under Controlled Pressure

The disclosure relates to external, portable systems and jig assemblies for cleaning clogged nozzles of ink jet print head under controlled pressure. The jig assembly can be self-contained and detachable, and can be programmed to operate upon receiving various signals indicating clogged nozzle plate or portion thereof, and/or as a routine maintenance operating procedure.