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Imagine these Scenarios:

  • Innovating freely without traditional manufacturing process constraints.
  • Printing individual sections of a circuit design for on-the-fly testing.
  • Creating vias and through holes with no drilling or plating required.
  • Printing electronic circuitry in-house in just hours.
  • Innovating while saving space, weight and cost with designs incorporating complex geometries and new functions.
  • Streamlined workflows and easy operation
  • Long uninterrupted 3D printing runs with minimal supervision for increased uptime.

Key Advantages

Time

Time

Reduces development cycles times. Enables on-site prototyping in a matter of hours instead of weeks, even for complex designs.

Cost

Cost

Eliminates need for large order minimums. Enables ability to discover design errors in early development stage with agile rapid prototyping.

24-7

24/7

Enables long, uninterrupted runs round the clock, with minimal supervision. This capability is designed to improve overall throughput of the system.

Automation

Automation

Automatic printhead management mechanism and algorithms, allowing for uninterrupted printing with minimal print job set up and preventive maintenance.

Complex Geometry

Complex Geometries

Enables increased design capabilities & manufacturability of components. Added agility enables designing, testing and iterating in real time, on site.

Component Consolidation

Component Consolidation

Multi-material Additive Manufacturing enables functional, compact, denser, non-planar electronics parts.

Confidentially

Confidentially

Enables retention of sensitive IP in-house during development. Eliminates concerns and costs related to IP infringement.

Environmental

Environmental

Limits environmental impact through optimized design, size, weight. Reduces waste with additive manufacturing capabilities.

Multi-Material Additive Manufacturing of Printed Electronics

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Simultaneous multi-material additive manufacturing is a
revolutionary approach that helps redefine the electronics of tomorrow for attributes including density, size and flexibility. The DragonFly LDM™ is fitted with two printheads, one for nano-Silver conductive ink and the other for dielectric polymer ink. This set-up allows the
DragonFly LDM™ to concurrently print with both advanced inks in a single print job.

DragonFly LDM inkjet deposition system is setting new precision standards for 3D printed electronics., making it ideal for industries with the most demanding design and quality requirements, such as aerospace, automotive, telecommunications, healthcare and more.

Virtually Limitless Design Flexibility

By synthesizing precision and accuracy with multi-material additive manufacturing, the DragonFly LDM™ unlocks a whole new world of design possibilities for printed electronics. A wide array of PCB features, such as vias and through-holes, can be fully 3D printed in-house without subsequent etching, drilling and plating. A range of non-planar electronic components, such as Molded Interconnect Devices (MIDs) and electromagnets, also can be printed and tested on-the-fly.

The DragonFly LDM™ is transforming how product development teams work – waiting days or weeks for a custom prototype to be fabricated offsite can finally be a thing of the past. The freedom to innovate empowers progress, encourages product advancement, lowers development risks and enables faster time-to-market. Ultimately, it creates a better end-product.

“Military sensor solutions require performance and reliability levels far above those of commercial components.” said HENSOLDT CEO, Thomas Müller. “To have high-density components quickly available with reduced effort by means of 3D printing gives us a competitive edge in the development process of such high-end electronic systems.”

HENSOLDT CEO, Thomas Müller

FAQs

How ready is the DragonFly LDM™ system?
The printer is now available for purchase.

Is it possible to upgrade from a DragonFly Pro to a DragonFly LDM system?
Yes, customers who acquired a DragonFly in the past, can purchase a upgrade to the DragonFly LDM.

What size and how complex is a PCB additively manufactured on the DragonFly LDM system?
The maximum size of the PCB is 16 cm X 16 cm x 0.3 cm. The complexity of the PCB for an unattended print depends on the amount of conductive ink necessary to complete the job. The system wizard alerts the user if the ink in the system is insufficient.

How many layers does the DragonFly LDM print?
The DragonFly LDM can print up to 3mm in thickness. Different designs require different layer thicknesses, so the number of layers printed by the DragonFly depends upon the board design.

How much does it cost to print?
While cost depends on the type of board, complexity, and volume of prototyping, some boards could cost as little as $10 to print. That’s in comparison to a standard prototype that might cost several thousand dollars. An added benefit of the DragonFly is the time saved, the increased confidentiality and accelerated innovation. The more prototyping, the higher the return on investment. In addition, an in-house 3D system will help change the way you work. Teams will work in parallel, rather than one after the other.

How similar and the DragonFly LDM materials to traditional materials?
The ink materials are engineered to give close performance to traditional materials. Nanoparticle Silver inks provide conductivity and are solderable. The Nano Dimension dielectric formulations simulate FR4 electrically and in terms of Td and Tg.

Are the materials suitable for soldering?
Yes, they are compatible with hand soldering, solder glue and vapor/ reflow soldering. We recommend low temperature pastes such as tin bismuth for example.

Can I send you a sample to print?
Yes, interested parties may send a Gerber file, within the Nano Dimension design rules and specifications. We can also provide a coupon under NDA.


Have more questions?
Contact us via the link below and we will get back to you as soon as possible.