The DragonFly LDM® Lights-Out Digital Manufacturing system is the industry’s only comprehensive additive manufacturing platform for around-the-clock 3D printing of electronic circuitry. This precision additive manufacturing platform uniquely integrates an extremely precise inkjet deposition printer with dedicated nano-inks and optimized 3D software to print electronic circuits such as Printed Circuit Boards (PCBs), antennas, capacitors and sensors. Incorporating proprietary, state-of-the-art Lights-out Digital Manufacturing (LDM®) technology, the DragonFly® requires little or no operator intervention.
With the DragonFly LDM® designers can move rapidly from concept and design validation to production of precision electronic components, while keeping the entire process securely in-house. Companies can now reduce demand on prototyping and short-run manufacturing resources and lower the total cost of operation in comparison to traditional manufacturing methods. The DragonFly LDM® is designed for industry 4.0 and manufacturing for the Internet of Things, and is the extension of the award-winning DragonFly Pro precision system.
“Military sensor solutions require performance and reliability levels far above those of commercial components.” said HENSOLDT CEO, Thomas Müller. “To have high-density components quickly available with reduced effort by means of 3D printing gives us a competitive edge in the development process of such high-end electronic systems.”
HENSOLDT CEO, Thomas Müller
Reduces development cycles times. Enables on-site prototyping in a matter of hours instead of weeks, even for complex designs.
Eliminates need for large order minimums. Enables ability to discover design errors in early development stage with agile rapid prototyping.
Enables long, uninterrupted runs round the clock, with minimal supervision. This capability is designed to improve overall throughput of the system.
Automatic printhead management mechanism and algorithms, allowing for uninterrupted printing with minimal print job set up and preventive maintenance.
Enables increased design capabilities & manufacturability of components. Added agility enables designing, testing and iterating in real time, on site.
Multi-material Additive Manufacturing enables functional, compact, denser, non-planar electronics parts.
Enables retention of sensitive IP in-house during development. Eliminates concerns and costs related to IP infringement.
Limits environmental impact through optimized design, size, weight. Reduces waste with additive manufacturing capabilities.
Simultaneous multi-material additive manufacturing is a
revolutionary approach that helps redefine the electronics of tomorrow for attributes including density, size and flexibility. The DragonFly LDM® simultaneous multi-material additive manufacturing is a revolutionary approach that helps redefine the electronics of tomorrow for attributes including density, size and flexibility. The DragonFly LDM™ is fitted with two printheads, one for nano-Silver conductive ink and the other for dielectric polymer ink. This set-up allows the DragonFly LDM® to concurrently print with both advanced inks in a single print job.
DragonFly LDM® inkjet deposition system is setting new precision standards for 3D printed electronics., making it ideal for industries with the most demanding design and quality requirements, such as aerospace, automotive, telecommunications, healthcare and more. is fitted with two printheads, one for nano-Silver conductive ink and the other for dielectric polymer ink. This set-up allows the DragonFly LDM® to concurrently print with both advanced inks in a single print job.
DragonFly LDM® inkjet deposition system is setting new precision standards for 3D printed electronics., making it ideal for industries with the most demanding design and quality requirements, such as aerospace, automotive, telecommunications, healthcare and more.
By synthesizing precision and accuracy with multi-material additive manufacturing, the DragonFly LDM® unlocks a whole new world of design possibilities for printed electronics. A wide array of PCB features, such as vias and through-holes, can be fully 3D printed in-house without subsequent etching, drilling and plating. A range of non-planar electronic components, such as Molded Interconnect Devices (MIDs) and electromagnets, also can be printed and tested on-the-fly.
The DragonFly LDM® is transforming how product development teams work – waiting days or weeks for a custom prototype to be fabricated offsite can finally be a thing of the past. The freedom to innovate empowers progress, encourages product advancement, lowers development risks and enables faster time-to-market. Ultimately, it creates a better end-product.
How ready is the DragonFly LDM™ system?
The printer is now available for purchase.
Is it possible to upgrade from a DragonFly Pro to a DragonFly LDM system?
Yes, customers who acquired a DragonFly in the past, can purchase a upgrade to the DragonFly LDM.
What size and how complex is a PCB additively manufactured on the DragonFly LDM system?
The maximum size of the PCB is 16 cm X 16 cm x 0.3 cm. The complexity of the PCB for an unattended print depends on the amount of conductive ink necessary to complete the job. The system wizard alerts the user if the ink in the system is insufficient.
How many layers does the DragonFly LDM print?
The DragonFly LDM can print up to 3mm in thickness. Different designs require different layer thicknesses, so the number of layers printed by the DragonFly depends upon the board design.
How much does it cost to print?
While cost depends on the type of board, complexity, and volume of prototyping, some boards could cost as little as $10 to print. That’s in comparison to a standard prototype that might cost several thousand dollars. An added benefit of the DragonFly is the time saved, the increased confidentiality and accelerated innovation. The more prototyping, the higher the return on investment. In addition, an in-house 3D system will help change the way you work. Teams will work in parallel, rather than one after the other.
How similar and the DragonFly LDM materials to traditional materials?
The ink materials are engineered to give close performance to traditional materials. Nanoparticle Silver inks provide conductivity and are solderable. The Nano Dimension dielectric formulations simulate FR4 electrically and in terms of Td and Tg.
Are the materials suitable for soldering?
Yes, they are compatible with hand soldering, solder glue and vapor/ reflow soldering. We recommend low temperature pastes such as tin bismuth for example.
Can I send you a sample to print?
Yes, interested parties may send a Gerber file, within the Nano Dimension design rules and specifications. We can also provide a coupon under NDA.
Have more questions?
Contact us via the link below and we will get back to you as soon as possible.