Oct 24, 2023
Additive Manufacturing Methods for Additively Manufactured Electronic (AME) Circuits, PCBS, and/or FPCs, and HDIPCBs
The disclosure relates to additive manufacturing methods for additively manufactured electronic (AME) circuits such as a printed circuit board (PCB), and/or flexible printed circuit (FPC), and/or high-density interconnect printed circuit board (HDIPCB) each having integrated raised and/or sunk BGA, SMT, and/or surface mounting sockets for SMT device(s) defined therein, and methods of coupling surface mounted devices such as BGA and/or SMT thereto.