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Hi-PED™ Capabilities

 Additive Manufacturing of Electronics

natcircuitboard

AME CIRCUITS WITH INTEGRATED FUNCTIONAL CAPACITORS

system in package front

AME SYSTEM IN PACKAGE / MULTI-CHIP MODULE

board front

AME LOW-PASS FILTER

chip front

AME IoT DEVICE WITH WIFI

click front

AME CIRCUIT WITH SIDE MOUNTED AND INSERTED COMPONENTS

AME Sample - Vertically Stacked IC (2)

AME SAMPLE OF VERTICALLY STACKED IC

Phased Array Dome front

AME RF ANTENNA DOME

side mounted front

AME PCB PLANAR DC-DC UP CONVERTER TRANSFORMER

USB front

AME MULTI-LAYER ARDUINO PCB

AME_ antenna miniaturization

AME ANTENNNA WITH METAMATERIAL

silvercasing

AME IC SHIELDING NANO SILVER CASING

inner side edge fig. 2

AME BOARD WITH SIDE CONTACTS