The DragonFly Pro can reduce assembly time for functional BGAs from days to one hour, eliminating the need for outside contractors for assembly and reflow
NESS ZIONA, Israel, April 24, 2019 –Nano Dimension Ltd., a leading additive electronics provider (NASDAQ, TASE: NNDM), announced today that the company’s pioneering DragonFly Pro systems have successfully shortened and simplified the assembly process for ball grid arrays (BGAs) and other surface mount technology (SMT) components used for integrated circuits, from days to one hour. This could not be achieved otherwise, due to the extended timelines and typically complex BGA assembly processes associated with traditional production methods.
In a recent qualification study, Nano Dimension’s Application Engineering team demonstrated the role of its award-winning DragonFly Pro, the only precision additive manufacturing system of its type worldwide, in enabling a shorter and simplified end-to-end process for mounting BGAs and other surface mounted electrical components into printed circuit boards (PCBs). Typically, the process from initial design through printing, soldering, manufacturing, assembly and reflow takes weeks to complete. With a special layout structure that can only be achieved through additive manufacturing of PCBs, there is no need for special tooling for assembly. This enables in-house manual assembly of BGAs and SMT components during the design and application development phase.
BGA top view of the board
Electronic devices with BGA and other SMT components are found in everything from small devices such as phones and watches, to large vehicles and airplanes. BGAs are a type of surface-mount packaging (a chip carrier) used for integrated circuits. A BGA provides more interconnection pins than can be put on a dual in-line or flat package, since the entire bottom surface of the device can be used rather than just the perimeter.
The in-house approach enabled by the DragonFly Pro eliminates all the stages of ordering and delivering assembled PCBs from external suppliers and enables companies to do a lot more tests and feasibility studies that would not be possible without in-house additive manufacturing of electronics. Under existing practices, making needed design changes is tedious, as it involves back-and-forth communication between different suppliers, often leading to delays, creating difficulties in predicting development times, and putting the BGAs at a higher risk for errors. The DragonFly Pro 3D-printed socket structure even improves mounting accuracy of the BGA component since there is less risk that the mounting position will shift.
BGA Socket structure allows to solder regular BGAs
“With the DragonFly Pro, companies can easily assemble BGA components within one hour,” said Amit Dror, CEO of Nano Dimension. “This means companies can do everything in-house, with no need for outside contractors, less risk of errors and they can complete complex PCB prototypes without high volume manufacturing processes. Greater flexibility enables teams to innovate more freely, resolve problems quickly, and makes it much easier to control product quality.”
About Nano Dimension Ltd.
Nano Dimension (NASDAQ, TASE: NNDM) is a leading electronics provider that is disrupting, reshaping, and defining the future of how cognitive connected products are made. With its unique 3D printing technologies, Nano Dimension is targeting the growing demand for electronic devices that require increasingly sophisticated features. Demand for circuitry, including PCBs - which are the heart of every electronic device - covers a diverse range of industries, including consumer electronics, medical devices, defense, aerospace, automotive, IoT and telecom. These sectors can all benefit greatly from Nano Dimension’s products and services for rapid prototyping and short-run manufacturing. For more information, please visit www.nano-di.com.
This press release contains forward-looking statements within the meaning of the “safe harbor” provisions of the Private Securities Litigation Reform Act of 1995 and other Federal securities laws. Words such as “expects,” “anticipates,” “intends,” “plans,” “believes,” “seeks,” “estimates” and similar expressions or variations of such words are intended to identify forward-looking statements. For example, Nano Dimension is using forward-looking statements in this press release when it discusses the potential of its products. Because such statements deal with future events and are based on Nano Dimension's current expectations, they are subject to various risks and uncertainties. Actual results, performance or achievements of Nano Dimension could differ materially from those described in or implied by the statements in this press release. The forward-looking statements contained or implied in this press release are subject to other risks and uncertainties, including those discussed under the heading “Risk Factors” in Nano Dimension’s annual report on Form 20-F filed with the Securities and Exchange Commission (“SEC”) on March 14, 2019, and in any subsequent filings with the SEC. Except as otherwise required by law, Nano Dimension undertakes no obligation to publicly release any revisions to these forward-looking statements to reflect events or circumstances after the date hereof or to reflect the occurrence of unanticipated events. References and links to websites have been provided as a convenience, and the information contained on such websites is not incorporated by reference into this press release. Nano Dimension is not responsible for the contents of third-party websites.
NANO DIMENSION INVESTOR RELATIONS CONTACT
Yael Sandler, CFO | email@example.com
NANO DIMENSION PR CONTACT
Galit Beck, Public Relations Manager | 972-542539495 | firstname.lastname@example.org