IEEE FLEPS 2023 Conference

The 2023 IEEE International Conference on Flexible, Printable Sensors and Systems will be held July 9-12 at Northeastern University (Boston, MA), and Nano Dimension is excited to serve as a Gold Sponsor!

IEEE FLEPS 2023 is intended to provide a forum for research scientists, engineers and practitioners throughout the world to present their latest research findings, ideas, and applications in the area of Flexible, Printable Sensors and Systems.

IEEE FLEPS 2023 will include keynote addresses and invited presentations by eminent scientists. Our Ryan Bahr will speak and also provide tour/tutorial of NU’s Dragonfly IV (Nano Dimension’s AME system).

Consider joining Nano Dimension’s NDEAR team there and find out more about our innovative additive manufacturing systems and related technologies.

For more information and to register, click here.