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Unlock the Future of Aerospace Innovation: Download our comprehensive whitepaper on Ceramic Applications for Aerospace and Defense Companies today

Discover the possibilities that modern SMT gluing provides, and get a better understanding of the glue process in electronic manufacturing.

the design and performance of planar capacitors fabricated with multi-material and multi-layered Additive Manufacturing Electronics (AME) technology, enabling capacitors with different areas and different layer counts resulting in capacitance values from a few picofarads (pF) to several nanofarads (nF).

This paper presents a few single-substrate multi-metal layer antennas using additively manufactured electronics (AME) solution based on piezoelectric additive fabrication. By vertically stacking metal layers in a 3D printed single substrate, the designed antenna prototype exhibits the advantages of wide bandwidth and ultra-low profile.

By taking advantage of the conductive and dielectric multi-material-integrated additive manufacturing technique, the proposed transmissive MS has an ultrathin thickness (0.11 free-space wavelength)

In the future, agile development, delivery speed, and efficient job coordination will add up to a decisive competitive advantage. This new white paper goes in depth to the specific engineering issues involved for successful implementation.

The realization of custom-designed 3D printed circuit boards (PCBs) was achieved with a Nano Dimension DragonFly 3D printer which enables PCBs that are designed around a standard 1.25mm ferrule for optical connection of the optical fiber to provide full compatibility with standard light delivery system.

In this work, a shared-aperture dual-band FZP metalens antenna is proposed by merging two single-band FZP metalens antennas, operating at distinct frequency bands, seamlessly into one. Instead of using conventional metallic conductors, double-screen meta-grids are devised in this work to form the concentric rings.

It’s very likely additive manufactured electronics (AME) will be central to building the next generation of highly integrated device antennas. The current high cost and long cycle of production for mm-wave antenna-in-package (AiP) makes proof-of-concept customized prototyping difficult.