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Design and Performance of Additively Manufactured In-Circuit Board Planar Capacitors
the design and performance of planar capacitors fabricated with multi-material and multi-layered Additive Manufacturing Electronics (AME) technology, enabling capacitors with different areas and different layer counts resulting in capacitance values from a few picofarads (pF) to several nanofarads (nF).
3D-Printed Low-Profile Single-Substrate Multi-Metal Layer Antennas and Array With Bandwidth Enhancement
This paper presents a few single-substrate multi-metal layer antennas using additively manufactured electronics (AME) solution based on piezoelectric additive fabrication. By vertically stacking metal layers in a 3D printed single substrate, the designed antenna prototype exhibits the advantages of wide bandwidth and ultra-low profile.
Achieving Multi-Material Ultrathin Metasurfaces with Additively Manufactured Electronics
By taking advantage of the conductive and dielectric multi-material-integrated additive manufacturing technique, the proposed transmissive MS has an ultrathin thickness (0.11 free-space wavelength)
The benefits of an all-in-one SMT solution for the electronics industry
In the future, agile development, delivery speed, and efficient job coordination will add up to a decisive competitive advantage. This new white paper goes in depth to the specific engineering issues involved for successful implementation.
Additively Manufactured Millimeter-Wave Dual-Band Single-Polarization Shared Aperture Fresnel Zone Plate Metalens Antenna
In this work, a shared-aperture dual-band FZP metalens antenna is proposed by merging two single-band FZP metalens antennas, operating at distinct frequency bands, seamlessly into one. Instead of using conventional metallic conductors, double-screen meta-grids are devised in this work to form the concentric rings.
Compact Multilayer Band Pass Filter Using Additive Manufacturing
It’s very likely additive manufactured electronics (AME) will be central to building the next generation of highly integrated device antennas. The current high cost and long cycle of production for mm-wave antenna-in-package (AiP) makes proof-of-concept customized prototyping difficult.
How 3D integrated electronics can take us beyond Moore’s Law.
Moore’s law is coming to an end according to many science and technology commentators. Among them is the celebrity theoretical physicist Michio Kaku who predicted in 2012: “In about ten years or so, we will see the collapse of Moore’s law.”