For the first time, product designers can 3D print professional multilayer PCB prototypes in-house, enabling full control of the development process, while reducing the inconvenience of design and test cycles. By combining conductive and dielectric materials in a single print job, the DragonFly 2020 Pro makes it possible to print a full range of multilayer PCB features — from intricate geometries to interconnections such as buried vias, and plated through holes -- seamlessly into multilayer PCBs for agile product development. The result is a high-quality, densely packed PCB, printed in less than 24 hours, ready for component placement and soldering.
3D printed electronics imposes no planar design limitations, making it ideal for the development of compact designs with higher functional density. This opens up new possibilities for rapid prototyping of unique parts such as electrically functional brackets that combine structural and electrical performance.Non-planar signal traces can form complex geometric forms such as special antenna designs embedding of electrical components or new approaches to packaging, all in a matter of hours -- not weeks that traditional MID manufacturing requires.
DragonFly™ 2020 Pro 3D Printer makes it possible to 3D print antennas, arrays and Radio Frequency Identification (RFID) tags using conductive nanoparticle silver and dielectric inks. This innovation enables antennas to play a role in more products and for antennas to be placed in new locations. The Internet of Things (IoT) and other connected technology applications, such as the adding of antennas to packaging or flexible antennas and RFID tags are just a few examples of the march of connectivity and thus antennas into more and more locations The ability to 3D print fine-featured circuitry with complex geometries and built-in antennas results from an additive manufacturing technology able to produce a better performing product with reduced product size and weight.
3D printed electronics opens the door to a world of new component embedding capabilities. With the ability to embed signal traces and both active and passive components inside 3D parts. Designers can produce prototypes with embedded sensors, antennas, complex geometries and more for simultaneous validation of form and functionality. All of the reasons that electronics designers seek to leverage embedding, such as form factor, functional density and component protection can be achieved.
DragonFly™ 2020 Pro 3D Printer makes it possible to 3D print electromagnetic coils, enabling product designers to vary physical shape and size for optimized application fit. By enabling increased Z direction tolerance 3D printing can deliver significant improvements electromagnet coil resolution. This gives product designers advantages over traditional processes, and enables more lightweight, compact end products, while saving on costs and lead time.
3D printed electronics leverage the unique ability to combine conductive and dielectric materials in one print, enabling time and cost savings for functional 3D printed molded interconnected devices (MIDs), including multi-layered MIDs. This allows for reducing dimensions or weight of shaped electronics. With the DragonFly Pro, the MID-creation process can be done on the fly, in one print job, maintaining industry standard line and pitch. Without the need for time-consuming outsourced processes , this leads to significant cost savings in prototyping and reduced development time.
The DragonFly™ 2020 Pro can 3D print rigid-flex circuits. Designs can combine the best of both worlds —rigidity where mechanical strength is needed and flexibility where bending is required. Rigid-flex circuits for prototyping are 3D printed, in one non-stop print job. The result is thinner, lighter more compact electronics. The ability to print varied mechanical properties and novel geometries results in greater design freedom.