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3D-Printed Electronics Service Bureau

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    Create Complex and Otherwise-Impossible Geometries

     

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    Innovative Components Tested More Rapidly

     

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    Design Customization Made Easy

     

Easily 3D-Print Electrified Objects

The 3D-Printed Electronics Service Bureau specializes in additive intelligence giving designers and engineers an unprecedented ability to develop smart, electrified objects that cannot be produced by any other method. 

Companies and individuals can 3D-print on demand a wide range of free-form electrified objects - with both conductive and dielectric materials - using Nano Dimension's DragonFly 2020 Pro 3D printing platform.  

Imagine being able to 3D-print fully functional devices such as sensors, antennas, molded interconnect devices (MIDs), complex geometries and more, to meet the challenges of rapid prototyping and shape the world of electronics. Well now you can with the 3D-Printed Electronics Service Bureau. 

See what can be achieved with our service bureau for 3D-printed Electronics:

 

Develop an Electromagnet

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 Your Partner in 3D-Printed Electronics

FAQ

Q. How does the service bureau work?

A. Users design their own components and then simply upload them directly to the Nano Dimension platform.

Q. What is the turnaround time?

A. The turnaround time depends on the design and our workload at the time of ordering. Typically, we will respond to your request within 24 hours of receipt of the order. If the prototype is urgent, please let us know.

Q. Which file formats are accepted?

A. Our preferred file formats are SOLIDWORKS and Gerber, but the following formats can also be accepted: Step, IGES, parasolid, electronic editing project, STP.

Q. What is required to print a 3D object that contains both conducting and insulating materials?

A.The easiest way to prepare a job for 3D printing is by using Nano Dimension’s SOLIDWORKS add-in. It can be installed on a stand-alone PC with SOLIDWORKS. In addition, there are several design rules that must be followed* (reference to design rules below). Other 3D software can be used, but the user is responsible for differentiating between the insulating and conductive materials within the design.

Q. What is the SOLIDWORKS add-in?

A. Nano Dimension’s SOLIDWORKS add-in enables users to move from 2D to 3D circuitry easily. With the add-in, users can design a 3D model in SOLIDWORKS and easily 3D-print it using the DragonFly 2020 Pro 3D Printer.

For installation and more information please contact us.

Q. Do you ship internationally?

A.Yes. We can ship anywhere the customer requires. International shipping charges will apply.

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Smart Products

3D-printed electronics is the most influential new medium for professional electronics development. We transform your 2D innovative vision into a 3D reality with our highly accurate and versatile DragonFly 2020 Pro 3D printer, and the ability to print conductive and insulating materials in one print job. We offer you the perfect 3D-printed electronics solution to enable virtually limitless design flexibility, improved product performance and customization. You can now 3D-print non-planer conductive traces, hidden vias and vertical walls, to develop breakthrough electronics of the future..

If you are an engineer, designer, or hobbyist, make the impossible possible, and bring your game-changing designs to the world of electronics by simply uploading your design requirements to our easy online ordering system. We will work with you to get your smart products to market quickly and cost-effectively.

 

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Materials

Nano Dimension’s high performance conductive silver nanoparticle ink (metal) and insulating ink (dielectric polymer) are optimized for a variety of applications. From proofs of concept, to design validation, to test fixtures, Nano Dimension materials help you succeed at every stage of the design and manufacturing cycle.

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Design Rules

Parameter

Recommended Value

Max Build Size  (X,Y,Z)

5cm x 5cm x 0.3cm (2" x 2" x 1/8")

Min. object size (via, through-holes)(X,Y Axis)

400 um (16 mil)

Min. spacing between conductors (X,Y Axis )

200 um (8 mil)

Min. spacing (Z Axis)

12 um (1/2 mil)

Min. trace

150 um (6 mil)

Max. wall angle

Vertical  (90o)

Support negative angles, cavities and voids

No

Edge spacing

1.25mm (50 mil)

Min. Layer thickness

12 um (1/2")

 

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